According to a new market report published by Transparency Market Research titled Chip Scale Package (CSP) LED Market – Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2018 – 2026,” the global chip scale package (CSP) LED market is expected to reach US$ 3,065.1 Mn by 2026. The market is projected to expand at a CAGR of 13.90% during the forecast period from 2018 to 2026. According to the report, the global chip scale package (CSP) LED market will continue to be influenced by a range of factors such as rising demand for chip scale package (CSP) LED from many backlight LED as well as flash LED applications, smaller form factor, and higher package density. Europe will continue to be at the forefront of global demand, with the market in the region growing at above 13% through 2026.

The global chip scale package (CSP) LED market is bifurcated by application into backlight LED, flash LED, automotive lighting, general lighting, and others. Others includes accent lighting and flexible edge-lit lighting. Automotive lighting application segment is projected to expand at a CAGR of more than 14% during the forecast period. Many companies are producing CSP LEDs at a higher volume, as the demand for LED lighting for the automotive segment is increasing for interior automotive lighting and taillight. Many CSP LED providers around the globesuch as OSRAM Opto Semiconductors GmbH, Nichia Corporation, and Lumileds Holding B.V. are developingnovel automotive LED components.

For instance, in 2016, Samsung Electronics, a company that provides component solutions, announced a novel CSP LED package named “Fx-CSP” to be used across automotive lighting applications. Furthermore, many companies from the CSP LED marketplace such as Genesis Photonics Inc., are seeking automotive luminaire certification for the Chinese market to enter into the supply chain. Genesis Photonics Inc. has already entered the Taiwanese market supply chain by obtaining“TS 16949” certification that is required to supply the products to the automotive industry.

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Commercial end-user is expected to dominate the chip scale package (CSP) LED market

Based onend-user, the chip scale package (CSP) LED market is segmented into residential, commercial, and industrial.Commercial end-user is projected to hold a higher market share, as a large number of well-established players from the CSP LED domain areproducing technologically advanced products. Moreover, demand for CSP LEDs for many commercial applications namely general lighting, flash LED used across smartphones, and backlight LED for slimmer TVs is increasing rapidly. Companies such as OSRAM Opto Semiconductors GmbH have also launched CSP LED made specifically for the retail lighting related applications.

Secondary research sources that are typically referred to include, but are not limited to company websites, annual reports, financial reports, broker reports, investor presentations, and SEC filings, internal and external proprietary databases, and relevant patent and regulatory databases, national government documents, statistical databases, and market reports, news articles, press releases, and webcasts specific to companies operating in the market, national government documents, statistical databases, and market reports, Factiva, etc.

Primary research involves e-mail interactions, telephonic interviews, and face-to-face interviews for each market, category, segment, and sub-segment across geographies. We conduct primary interviews on an ongoing basis with industry participants and commentators in order to validate the data and analysis. Primary interviews provide firsthand information on the market size, market trends, growth trends, competitive landscape, and outlook, etc. These help us to validate and strengthen secondary research findings. These also help to develop the analysis team’s market expertise and understanding.

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Global Chip Scale Package (CSP) LED MarketCompetitive Dynamics

The report highlights well-established players such as OSRAM Opto Semiconductors GmbH, LG Innotek, Lumileds Holding B.V., and Samsung Electronics Co., Ltd. These players are innovating novel products pertaining to chip scale package (CSP) LED. In January 2018, LG Innotek developed a “flip-chip LED package” that provides prominent luminous flux along with higher efficiency without affecting the performance. The product is in the form of chip scale packaging and is expected to be helpful for various backlighting applications worldwide.