Wafer Level Packaging (WLP) is intrinsically a chip size package and has the huge potential for future single chip packages. Wafer Level Packaging (WLP) technologies have been segmented, among which two major categories can be identified, fan-in WLP and fan-out WLP technologies, respectively. The market has been bifurcated into by application automotive, telecommunication, consumer electronics, industrial, medical, defense and aerospace, among others. Furthermore, the market by geography has been segmented into Europe, Asia Pacific, North America, South America, Middle East and Africa.

Some of the major players operating in the Fan-in WLP market are:
Amkor Technology Inc.( Arizona, The U.S.), Aixtron SE (Herzogenrath, Germany), AT&S (Leoben, Austria), Chipbond Technology Corp.(Taiwan), China Wafer Level CSP Co. Ltd. (Suzhou, China), Chipmos Technologies Inc.(Taiwan), DECA Technologies (The U.S.), Fujitsu Ltd.(Tokyo, Japan), International Quantum Epitaxy Plc (U.K.), Insight SIP (France), Jiangsu Changjiang Electronics Technology Co. Ltd (China), Nanium, S.A (Portugal), Nemotek Technologie (Morocco, North Africa), Powertech Technology Inc.(Taiwan), Qualcomm Inc.( California, The U.S.), Siliconware Precision Industries Co., Ltd (Taiwan), SUSS Microtec (Germany), Triquint Semiconductor Inc. (Oregon, The U.S.) and Toshiba Corp (Japan) among others.

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Fan-in WLP technology confirms its presence on the semiconductor industry with indisputable advantages associated to form and cost factor. In addition, technological advancement and innovation continues and widens the area of possibilities of fan-in WLP solutions. Increasing application and usage of fan in wafer level packaging in automotive, consumer electronics and industrial applications is fueling the demand for advanced fan-in WLP solutions globally.  Moreover, the “IoT” (Internet of Things) promises a wide array of new applications for which fan-in WLP would be a ideal option presenting an lucrative opportunity to boost the demand further.

Fan in wafer level packaging solution is playing an important role in semiconductor packaging field owing to the rapid advances in IC (integrated circuit) fabrication. Furthermore the demand for lighter, faster, smaller and cost effective electronic equipments with high performance and low-cost packaging is one of the prime factors fueling the market for fan-in wafer level packaging solutions. WLP have application in the ICs used in consumer electronic devices; for example, smartphones and other semiconductor devices. Growing demand for technologically advancement in mobile devices which are capable of performing an array of programs in a single small-end product is one of the prime factors fueling demand for fan-in wafer level packaging technology than the conventional form of packaging solutions.

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