Underfill Market 2023 | Silicone-free Underfill Materials for Next-gen High-reliability Electronics Applications to Drive Market

Most successful semiconductor and electronics producers have established their business in countries of Asia Pacific. Hence, companies in the underfill market are now exploring untapped opportunities in North America and Europe to broaden their scope for new revenue streams. On the other hand, manufacturers are increasing their focus on next-gen high-reliability electronics applications. For instance, in April 2019, leading chemical and consumer goods company Henkel AG announced the launch of its new silicone-free underfill material that can be used in electric vehicles (EVs). The growing adoption of electric vehicles and the ever-increasing automotive industry are generating incremental opportunities for manufacturers in the underfill market.

Moreover, leading players are collaborating with online distribution platforms to increase the uptake of underfill materials. Uniform and void-free encapsulating underfill are being highly publicized to maximize a device’s temperature cycling capability. Manufacturers are increasing R&D to develop fast curing underfill that provide essential interconnect protection from shock, drop or vibration.

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Companies Innovate in Underfill Materials to Protect Fine-pitch Array Devices

Innovative underfill materials are helping companies to gain global recognition. As such, top five players continue to account for ~70-75% of the underfill market. Leading players are increasingly participating in trade events to tie up with potential partners. Companies in the underfill market are initiatives to deliver products that are reliable, prioritize sustainability, and enhance the performance of next-gen electronic devices and systems. Manufacturers are working closely with practicing engineers that are capable of developing cost-effective and innovative underfill materials.

Moreover, manufacturers are increasing their research efforts to develop underfill materials that offer reliable device protection, even in challenging conditions. They are increasing their production capabilities to develop underfill that protects fine-pitch array devices with the help of highly filled formulations that adapt to exceptionally advanced glass transition temperatures.

Customization Options for Embedded Systems Cater to Convenience of End-use Stakeholders

The demand for embedded systems is projected to grow in the coming years. This trend has led to the demand for compact-sized components, unmatched reliability, and their ability to withstand harsh conditions. All these factors contribute to the growth of the underfill market, which is expected to reach a revenue of ~US$ 600 Mn by the end of 2027.

Manufacturers in the underfill market are offering various options to its stakeholders to increase the reliability of their final-product embedded systems. For instance, Transcend Information, Inc.— a leading manufacturer of industrial-grade products, is offering corner bond and underfill materials to stakeholders dealing in embedded products to enhance the product’s reliability under high vibratory stress or high gravitational acceleration.

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Ongoing investments in developing cutting-edge technologies and innovations in embedded-use flash and DRAM products are generating revenue streams for manufacturers. Underfill materials are being pervasively used in ball grid array-based storage such as in handheld devices that must pass drop or tumble tests. This is evident since ball grid array application segment is estimated to account for the third-highest revenue in the market for underfill.

Reasonable TCB Costing to Fuel Proliferation of IoT in 5G Applications

Companies in the underfill market are tapping into incremental opportunities to develop pre-applied underfill materials that support collective bonding processes. This trend has led to exponential growth of the underfill market, which is anticipated to reach an output of ~1,180 tons by the end of 2027.

However, proliferation of IoT in various 5G applications leads to barriers in semiconductor packaging technologies. For instance, the flip chip bonding technology is required for the development of ultrafine-pitch products such as graphic, network, and AI processors. In order to achieve this, companies are adopting thermal compression bonding (TCB) with the help of pre-applied underfill materials. However, the scarcity of underfill materials such as nonconductive paste or nonconductive film has led to high process cost. Hence, there is a need for reasonable TCB costing to support the expansion of IoT in 5G applications. There is a growing need to maximize the production of underfill materials to support multiple die bonding processes.

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