Global ESD Bags & Pouch Packaging Market: Snapshot
ESD (electrostatic discharge) bags and pouch packaging is characterized of providing a partial or complete protective shield from static charges for various ESD-sensitive items, notably electronics and electrical devices and equipment. Commonly made of polymers or metals, the packaging is often resistant to electrostatic discharge and shields the content of the packaging from static charges in different external environments. ESD bags and pouch find substantial demand for storing and in shipping of electronics and they provide the required visibility to identify such sensitive items. ESD packaging has been found to be useful in providing a static safe environment required in a number of end-use industries including electrical and electronics, automobile, manufacturing, aerospace, and healthcare. The use of numerous military equipment world over, such as fire control and navigation systems that are highly sensitive to ESD has intensified the need for such bags and pouches.
The ESD bags and pouch packaging market is estimated to be valued at US$358.9 Mn in 2017 and is projected to reach US$495.0 by the end of 2024. The market is projected to register a CAGR of 6.6% from 2017 to 2024.
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Conductive and Dissipative Polymers form Dominant Material and Additive Type for ESD Packaging
Based on material and additive type, the various segments are conductive and dissipative polymers, metal, and additive. Of these, the largest is ESD bags and pouch made of conductive and dissipative polymers. The substantial demand for these materials types is attributed to their versatility of applications in the comprehensive protection of ESD-sensitive components. The segment is worth US$311.2 Mn in 2017, representing a whopping share of 86.7% and is estimated to reach a worth of US$ 433.9 Mn by 2024 end. The annual growth of the segment is pegged at US$ 24.5 Mn from 2017 to 2024, rising at a CAGR of 6.9% during the same forecast timeline. Among all material and additive types, this segment is projected to hold 87.6% share of the market by the end of 2024.
Asia Pacific excluding Japan to Hold Major Revenue Share throughout Forecast Period
The various regional markets for ESD bags and pouch packaging are Latin America, North America, the Middle East and Africa, Europe, Asia Pacific excluding Japan (APEJ), and Japan. Among these, the APEJ ESD bags & pouch packaging market is predicted to be the most attractive regional market and is anticipated to hold the dominant share throughout the forecast timeline. The regional market is projected to expand at a CAGR of 7.0% during 2017–2024 and is anticipated to create an opportunity of US$68.3 Mn over this period. The substantial demand for ESD bags and pouch is fueled by a burgeoning electronics and semiconductor sector in the region, thereby propelling the demand for packaging to protect the buildup or rejection of static charges in devices and components.
The absolute opportunity contributed by the APEJ market is estimated at US$ 68.3 Mn from 2017 to 2024.
Europe and Japan to Offer Promising Opportunities
Europe and Japan are prominent regional markets for ESD bags and pouch packaging with the demand driven by the need for ESD shielding for a number of sensitive devices, equipment, and component. Europe ESD bags & pouch packaging market hold a share of 17.2% of the global ESD bags & pouch packaging market vis-à-vis revenue by the end of 2017 end.
Meanwhile, the Japan ESD bags & pouch packaging market is estimated at 6.7% share of revenue in the global market by 2017. The regional market is projected to gain a share estimated at 8 basis points (BPS) between 2017 and 2024.
Competitive Analysis
Key players profiled in this report are Desco Industries, Inc., Tekins Limited, Elcom (U.K.) Ltd., GWP Group Limited, Botron Company Inc., Conductive Containers, Inc., Conductive Containers, Inc., Electrotek Static Controls Pvt Ltd, and Statclean Technology (S) Pte Ltd. A number of players are focused on launching ESD bags and pouch made of advanced materials with excellent barrier properties, in order to stay ahead of the pack.
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Demand in Packaging of Advanced Electronics to Boost Valuation of ESD Bags & Pouch Packaging Market
Antistatic packaging materials are widely used in ESD bags and pouches for packaging stuff that are sensitive to electrostatic charges. Thus, ESD bags and pouches materials are popularly used in packaging wide range of sensitive electronic circuitries, military-grade electronic components, and such items whose functionality may be impaired by ESD. Growing shipping of printed circuit boards and network cards in such pouches has bolstered the uptake in the ESD bags and pouch packaging market. Advances in PET processing have allowed packaging manufacturers to meet a variety of functional and aesthetic characteristics of the packaging in end-use applications. Products with different multilayer design parameters are gathering traction in the ESD bags and pouch packaging market. High-end electronics that can be damaged by sparks are also packaged using ESD bags and pouch packaging. Electronics manufacturers are keen on adopting economically priced products. Hence, packaging companies catering to the demand are keen on using cost-effective materials and manufacturing technologies. The growing use of multilayer barrier packaging for various types of electronics and semiconductor components has boosted the sales of packaging companies in the ESD bags and pouch packaging.
The COVID-19 pandemic has led to numerous disruptions in industries across the globe. Some businesses were realign their strategic and operational frameworks to remain agile and reduce the loss of revenues especially in the early part of 2024. Rapid pace of use of digital networks across enterprises has witnessed uptick in the latter part of the year. This has also boosted the prospects in the ESD bags and pouch packaging market. Further, growing spending on sourcing military-grade electronics in several developing nations has also imparted a robust fillip to the transportation of such electronic components, thereby spurring the utilization of ESD bags and pouch packaging. Also, rapidly growing internet of things is fueling the demand for electronics, which, in turn, is propelling the demand for ESD bags and pouch packaging.
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