Electromagnetic Compatibility (EMC) can be defined as the capacity of an electrical appliance in an electromagnetic environment, to work efficiently without being influencing or affected by the other devices in its surrounding area. The miniaturization of electronic components and devices has amplified the complexity of devices and acts as a cause for various Electromagnetic interference problems.
Electromagnetic Compatibility (EMC) design is emerging as an essential element of product design. The growth of Wi-Fi, 3G and added features in cell phones and various similar enhancements in product blueprint act as the key driving forces for EMI shielding market. In addition, the steady migration to wireless from wired technology and the development of a various regulations and directives favoring EMC shielding solutions act as a driving force for the EMC shielding market. Alternatively, the rising miniaturization of electronic devices, high cost involved and high complexity act as restrains for the growth of the market.
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Let’s take an example of automotive industry, the escalating adoption of infotainment systems (wireless based) and navigation systems are acting as novel revenue prospects for EMI shielding solutions. For electromagnetic shielding usual equipments used are sheet metal, metal foam and metal screen. Any holes in the mesh or shield have to be considerably minor than the radiations wavelength that has to be kept out, or else the enclosed space will not efficiently estimated an unbroken conducting shell. Coating the inside wall of the enclosed surface with a metallic ink or alike material is another frequently used shielding method, particularly with electronic goods in plastic enclosures. The ink contains carrier substance loaded with an appropriate metal, typically nickel or copper, in the form of tiny particulates. The ink is sprayed on to the area and, as dries, converts itself into a continuous conductive layer of metal.
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Some of the key players in the electromagnetic compatibility shielding market are Laird Technologies, Chomerics a division of Parker Hannifin Corporation, Comtest engineering B.V., Tech-Etch, Creavac-creative Vakuumbeschichtung GmbH, ERA Technology LTD., Dow Corning Corp, Intermark USA Inc. and Leader Tech. among others. This research report analyzes this market depending on its market segments, major geographies, and current market trends.
This report is a complete study of current trends in the market, industry growth drivers, and restraints. It provides market projections for the coming years. It includes analysis of recent developments in technology, Porter’s five force model analysis and detailed profiles of top industry players. The report also includes a review of micro and macro factors essential for the existing market players and new entrants along with detailed value chain analysis.
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