Wafer Back Grinding Tape for Surface Protection of Semiconductor Wafers
- The wafer back grinding is process of reducing wafer thickness for packaging of integrated circuits. Wafer back grinding tapes are applicable for surface protection of semiconductor wafers during back grinding process.
- These tapes help to hold packages during dicing process. Moreover, this can be easily removed from wafer without stress using irradiation technique. They are also used in wide area material, not only semiconductor wafer, but also sapphire, glass, ceramics, and others.
- The wafer back grinding tapes constitute of two-ply construction of adhesive layer and backing film. It offers various advantages including overall cost reduction, prevention of wafer from breakage, and wafer surface protection.
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Key Drivers of Global Wafer Back Grinding Tape Market
- Demand for wafer back grinding tapes is expected to increase, owing to rise in need of semiconductor wafer fabrication for production of photonic and electrical circuits. These are expected to be key factors driving the global wafer back grinding tape market during the forecast period.
- Wafer fabrication helps in building components for various products such as smartphones, television amplifiers, optical computer components, and other electronic components. Moreover, increase in consumer electronics market indirectly drives the demand for wafer back grinding tape. This factor is expected to fuel the global Wafer back grinding tape market during the forecast period.
- Companies operating in the global wafer back grinding tape market are investing to expand their product portfolios and improve their distribution networks. They have adopted strategies such as mergers & acquisitions, development of new products, joint ventures, and expansions to cater to increase in demand for wafer back grinding tape in different regions. For instance, in April 2017, LINTEC Corporation, introduced the Back Grinding Tape Laminator “RAD-3520F/12”, to protect the circuit surface of the wafer during the back grinding.
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UV Wafer Back Grinding Tape Segment to Offer Attractive Opportunities
- The UV type segment of wafer back grinding tape market expected to grow at highest CAGR rate during forecast period
- The UV wafer back grinding tapes are used in a diverse range of materials. Moreover, these wafer back grinding tapes offer various advantages such as surface protection, easy de-taping, and strong adhesive strength.
- These factors are expected to increase the demand of the UV wafer back grinding tape during the forecast period.
Key Players Operating in Global Market
The global wafer back grinding tape market is highly concentrated with top manufacturers accounting for approximately 25%–35% of the market share. A few of the key players operating in the global wafer back grinding tape market are:
- FURUKAWA ELECTRIC CO., LTD.
- Sumitomo Bakelite Co., Ltd.
- Mitsui Chemicals America, Inc.
- Nitto Denko Corporation
- LINTEC Corporation
- Loadpoint Limited
- Denka Company Limited
- Pantech Tape Co. Ltd
- NEPTCO, Inc.
Global Wafer Back Grinding Tape Market: Research Scope
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Global Wafer Back Grinding Tape Market, by Type
- UV
- Non-UV
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