Semiconductor Assembly and Test Services Market – 3D Designs Set in Paradigms for Breakthroughs
With the demand for semiconductors rising at an unprecedented rate, ancillary service sectors for the core semiconductor industry, including semiconductor testing and packaging, is witnessing a renaissance too. Innovations in semiconductor packaging and scope for the full-range back-end testing of semiconductors offered by some leading companies are prolific developments in the expanse of semiconductor assembly and test services market.
The emergence of 3D semiconductor assemblies is deemed revolutionary in the scope of semiconductor assembly methodologies. This has enabled the entire electronics industry to maximize the functionality of its products.
For semiconductor assemblies, multiple die packaging commonly uses some substrate as a base. Precisely, a semiconductor assembly on a substrate is akin to the one used for standard integrated circuit (IC) packaging on lead frames. Nonetheless, serving to be an advantage, the range of materials for substrate-based IC packaging is wide, along with several alternatives for the assembly of IC packaging. This holds scope for the expanse of substrate materials and packaging assemblies for semiconductors.
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Semiconductor Assembly and Test Services Market – Winning Imperatives
Outsourcing Practices Open Vast Scope of Growth
Changing practices of outsourcing by OEMs and chipmakers of electronic components are setting new trends in the entire electronics industry ecosystem, including the packaging and testing of semiconductor assemblies. While the outsourcing of semiconductor assembly and test services is currently registered to be only 50%, substantial volume expansion of these practices is predicted. This serves to be an advantage for players in the semiconductor assembly and test services market.
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Apart from this, the gamut of electronics and electrical components for automotive vehicles is vast. Sensors, alternators, actuators, batteries, generators, oxygen sensors, starter solenoids, and high-power electrical systems are a few, all of which require semiconductors extensively.
Foundries to Remain at the Fore
Among a slew of end users, the foundries segment is anticipated to register a high CAGR in the semiconductor assembly and test services market, finds TMR. Predominantly, this is because foundries feature the provision for refining and production of silicon and other metals for semiconductor packaging.
From a geographical perspective, vis-à-vis revenue, Asia Pacific is predicted to hold a leading share in the semiconductor assembly and test services market over the forecast period. Vast expansion of the electronics industry in the region has influenced the demand for semiconductor assembly and test services enormously.
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