The wearable devices market has been experiencing explosive growth during the past couple of years. The demand for low-voltage applications in wearable devices has triggered growth for the low-power bridges market. Companies in the low-power bridges market space are innovating in motor driver ICs (integrated circuits) of wearable devices. Increasing consumer awareness about health and fitness has propelled market players to develop consumer-centric fitness trackers, smartwatches, and sports equipment.
Companies in the low-power bridges market are innovating new motor driver ICs of wearable devices. Low-voltage innovations are increasingly meeting the consumer need for efficient battery-powered devices that are portable. Manufacturers in the low-power bridges landscape are increasing R&D to gain excellence in motor control of wearable devices. Growing demand for compact-sized devices has led to the development of motor controls packed with tiny ICs. Companies are focusing on enhancing user experience with improvements in the quality of wearable devices. Low-input voltage in devices offers power savings for consumers, which adds value to the newly introduced devices with an extended battery lifetime.
I2C V/S SPI: Which is better for Your Company?
I2C (inter-integrated circuits) and SPI (serial to peripheral interface) protocols offer unique strengths and weaknesses for companies in the low-power bridges market. SPIs are being increasingly used in IC controllers and peripherals to communicate with each other. On the other hand, I2C is gaining increasing popularity as a standardized serial communication protocol. This protocol is being increasingly used for communication between chips on a PCB (printed circuit board).
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However, SPI is not an official standard for deployment in many devices. On the other hand, I2C is popular for communication between components. However, with technological advancements, faster data transmission modes are pervasively replacing I2C. Perhaps these limitations pose a challenge for manufacturers in the low-power bridges market, who find it difficult to develop wearable devices with secure contactless applications.
Despite the limitations, manufacturers in the low-power bridges ecosystem are learning the technicalities of SPI and I2C with their implementations between master controllers and slave peripherals for better product development.
Companies Innovating in Photorelays for Development of Compact-sized Thermostats
Tried and tested technology acts as a reliable strategy for companies in the low-power bridges market. This strategy is being used by them to develop photorelays with low voltage circuits. Companies in the low-power bridges market are expanding their production capabilities to develop photorelays that are increasingly replacing conventional mechanical relays in thermostat designs. They are capitalizing on the demand for sleeker-looking devices, which is possible with the help of photorelays.
A unique research methodology is utilized by TMR to conduct comprehensive research on the global low-power bridges market and arrive at conclusions on the future growth prospects of the market. This research methodology is a combination of primary and secondary research, which helps analysts warrant the accuracy and reliability of the conclusions drawn.
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Secondary research sources referred to by analysts during the production of the report on the global low-power bridges market include statistics from company annual reports, SEC filings, company websites, World Bank database, investor presentations, regulatory databases, government publications, and market white papers. Analysts have also interviewed senior managers, type portfolio managers, CEOs, VPs, and market intelligence managers, who have contributed to the production of TMR’s study on the global low-power bridges market as a primary research source.
