The evolving semiconductor industry has created new avenues for the use of electronic components in a range of devices. With growing use of electronic chips and chipsets, the demand for die-attach materials – a key constituent in the production of electronic boards – is witnessing an upsurge. High thermal conductivity, low-temperature sintering, and conducive to low costs are some of the key criterion influencing the sales of die-attach materials across the globe.
An exclusive Transparency Market Research report reveals that by the end of 2026, nearly US$ 970 Mn worth of die-attach materials will be sold in the global semiconductors industry. The demand for die-attach materials, however, is estimated to incur restraints from production complexities, raw material procurement challenges and increasing technical expectations. During the forecast period, 2017-2026, the global die-attach materials market is pegged to expand at a sluggish CAGR of 3.1%.
The report has analysed the global die-attach materials market on the basis of form, material, and product type. On the basis of the form of die-attach materials, the demand for powdered materials is expected to drop in the upcoming years. Inefficiency in the electrical flow caused by the use of powdered die-attach materials will continue to impede their demand in the global market during the forecast period. Concurrently, the global sales of paste-based die-attach materials will witness a considerable surge throughout the forecast period. In 2017, over US$ 280 Mn worth die-attach materials in the form of pastes are expected to be sold across the globe.
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Polymer Adhesive Materials to Remain in Great Demand
Through 2026, the report expects a high demand for polymer adhesives in the global die-attach materials market. In 2017, more than US$ 300 Mn worth of die-attach materials developed as polymer adhesives will be sold in the global market. Since adhesion to polymer surfaces is the key functionality of die-attach materials, manufacturers are likely to focus on extending the production capacities for polymer adhesive type of die-attach materials.
The report further reveals that eutectic die-attach materials will witness a considerable dip in their contribution to the global die-attach materials market revenues over the forecast period. By the end of 2026, eutectic die-attach materials will account for a little over one-third share on the global revenues.
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The report provides an executive summary that outlines the key research findings and market size estimations. An overview of the global semiconductors industry, followed by an unbiased introduction to the global die-attach materials market is provided in the report. The report also classifies different types of die-attach materials present in the market. In addition, the report provides a distinct section analyzing the factors influencing the dynamic growth of the global die-attach materials market.
From industry trends to new applications, the report has analyzed every aspect of die-attach materials to depths. Analysis of supply chain, raw material sourcing strategies, and costing structure has been offered in the report. The study also offers an intensity map that reveals the presence of each market participant across global geographies. The report has provided detailed profiling of companies partaking in the growth of the global die-attach materials market. These companies have been profiled on the basis of their current market standings and strategic developments.
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Scope of the Report
Transparency Market Research develops credible business documents that can help market participants form new strategies and change their traditional outlook. Through a slew of primary and secondary research methodologies, the report has been validated across multiple levels. The entire report has been quantified into US dollars (US$), wherein market size estimations have been interpreted across metrics such as compounded annual growth rates (CAGR), Year-on-Year (Y-o-Y) growth rates, and absolute dollar opportunities. Quantitative data and qualitative information have been blended to create precise forecast on the global die-attach materials market.
Furthermore, the report has been developed by assessing the information procured from interviews conducted between analysts and company representatives. The scope of the report is to create new avenues for product development for the die-attach materials manufacturers by revealing valuable insights through its inferences.
