Chemical Mechanical Planarization of Silicon Enables Development of New Electronics
Chemical mechanical planarization (CMP) is a fundamental technology in the consumer and industrial electronics landscape. Companies in the chemical mechanical planarization market are increasing their production capabilities to meet increasing demands for high-precision electronic wafers. Thus, global planar uniformity is benefitting the semiconducting substrates value and supply chain.
Innovations in CMP have enabled the development of state-of-the-art consumer electronics. Companies in the chemical mechanical planarization market are using silicon to develop high-performance semiconductors. As such, compound semiconductors account for the third-highest revenue amongst all applications in the chemical mechanical planarization market, with an estimated value of ~US$ 700 million by the end of 2027. Thus, the semiconducting properties of silicon make it an ideal choice for the production of transistors, diodes, and microelectronics, amongst others.
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Companies in the chemical mechanical planarization space are gauging the incremental opportunities available, as abundance of silicon on the Earth make it a cost-efficient material for the production of high-quality electronic devices. The cost-effectiveness of silicon is likely to lead innovation in electronic devices toward ultra-large-scale-integration and systems-on-chips.
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Advanced Polishing Pads Help Production of High-performance Devices
Chemical mechanical polishing pads play a crucial role in the overall performance of the polishing process. As such, pads are predicted to dominate the chemical mechanical planarization market, and record the second-highest revenue amongst all consumables, with an estimated value of ~US$ 1.3 billion by the end of 2027. Thus, companies are capitalizing on the sales of high-performance devices that have low cost and low power consumption, and are developed with the help of advanced polishing pads. Growing trends of IoT, longer battery life, and mobility are anticipated to contribute to the exponential growth of the chemical mechanical planarization market.
Manufacturers in the chemical mechanical planarization landscape are increasing their focus on device scaling. They are experimenting with advancements in lithography and vertical device integrations for 3D devices. Material innovations also play a dominant role with the implementation of metal gate and novel compound solutions in devices. CMP is becoming increasingly popular in non-IC (integrated circuit) applications, such as the fabrication of micro lens array for improved extraction of light from LED (light emitting diodes).
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High-quality Slurries Meet Increasing Requirements in Complex CMP Processes
There is growing demand for high-quality CMP slurries in semiconductor applications. Likewise, the chemical mechanical planarization consumables market is consolidated, with only four major players accounting for ~60% of the market share. Hence, companies are competing to offer high-quality slurries for complex CMP processes. Companies in the chemical mechanical planarization market are increasing their production capacities to deliver higher volumes of dielectric and metal polishing solutions. They are increasing investments in advanced slurry technology with the help of well-funded R&D programs.
Companies in the chemical mechanical planarization ecosystem are focusing on growing their product portfolios by increasing the availability of premium-quality nitride and polysilicon slurries that can increasingly meet defect reduction requirements. These requirements are complemented with the demand for tighter specifications, at a lower cost of manufacturing. Companies in the chemical mechanical planarization market are making widespread use of water-glass colloidal silica slurries in semiconductor devices.
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